Semiconductor component with ball grid array (BGA)

摘要

The semiconductor component (1) has numerous solder balls as outer electrodes (3) on its assembly surface, with the electrodes containing energy supply (3a), earth (3b), and signal electrodes (3c). The energy supply and earth electrodes are so spaced that their distance is greater than the division of the solder balls, ie. 1 mm or less. Between any arbitrary energy supply electrode and adjacent earth electrode is located a signal electrode.