| 摘要 |
The integrated circuit includes a substrate (2) provided with terminal contacts (3,6,9,12,13). At least one secondary terminal contact (4,8,11) is provided on the substrate and is connected via a loop-through conductor path (5,7,10) extending in the region of the substrate to at least one terminal contact (3,6,9). The loop-through conductor path extends at least partly within the substrate, and more specifically at least one loop- through conductor path ends in a contact pad, which is formed for contacting (bonding) by using a wire-bond technique.
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