METHOD FOR MAKING A SEMICONDUCTOR CHIP OR A WAFER WITH PROTECTIVE LAYER

摘要

The invention concerns a method for making a semiconductor chip or a wafer with a protective layer (4) covering at least the surface comprising the circuit. Said method consists in producing conductive protuberances (3) on the semiconductor substrate (1) contact surfaces (2), applying the protective layer (4), and removing the protective layer (4) parallel to the semiconductor substrate surface until the protuberances (3) are exposed for the metal coating.