发明名称 RESIN COMPOSITION
摘要 <p>A resin composition comprising (A) an ethylene/vinyl alcohol copolymer, (B) a polyamide resin, (C) a random ethylene/unsaturated carboxylic acid copolymer or a metal salt thereof, and (D) a thermoplastic resin other than the above-described resin, which has a solubility parameter of 11 or below (calculated according to the Fedors equation), in weight ratios satisfying the following formulae (1) to (4): (1) 0.6≤W(A+D)/W(T)≤0.995; (2) 0.005≤W(B+C)/W(T)≤0.4; (3) 0.01≤W(A)/W(A+D)≤0.99; (4) 0.02≤W(B)/W(B+C)≤0.98; wherein: W(A): weight of (A) in the composition, W(B): weight of (B) in the composition, W(C): weight of (C) in the composition, W(D): weight of (D) in the composition, and W(T): total weight of the whole composition. This resin composition comprises the ethylene/vinyl alcohol copolymer excellent in barrier property, mechanical strength, softness, stretchability, melt stability, scrap recovery, thermal adhesion, coatability, staining resistance, transparency, etc., and the thermoplastic resin having the above-specified solubility parameter, and has a good compatibility.</p>
申请公布号 WO1999011707(P1) 申请公布日期 1999.03.11
申请号 JP1998000947 申请日期 1998.03.09
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