发明名称 Power semiconductor device has a semi-insulating polysilicon layer
摘要 A power semiconductor device has an insulation layer, which is formed on the substrate between a conductive region and an insulating channel-stop region, and a semi-insulating polysilicon (SIPOS) layer which covers the insulation layer while leaving parts of the conductive and channel-stop regions exposed. A power semiconductor device has a base region formed within a collector region in a semiconductor substrate, an emitter region formed within the base region, a channel-stop region isolated by a preset distance from the base region, an insulation layer formed on the substrate between the base region and the channel-stop region, a SIPOS layer covering the insulation layer while leaving parts of the base, emitter and channel-stop regions exposed, and base, emitter and equipotential electrodes respectively contacting the base, emitter and channel-stop regions. An Independent claim is also included for a power semiconductor device which has an anode region formed within a cathode region in a semiconductor substrate, a channel-stop region isolated by a preset distance from the anode region, an insulation layer formed on the substrate between the anode region and the channel-stop region, a SIPOS layer covering the insulation layer while leaving parts of the anode and channel-stop regions exposed, and anode and equipotential electrodes respectively contacting the anode and channel-stop regions.
申请公布号 DE19836283(A1) 申请公布日期 1999.03.11
申请号 DE19981036283 申请日期 1998.08.11
申请人 SAMSUNG ELECTRONICS CO. LTD., SUWON, KYUNGKI, KR 发明人 PARK, CHAN-HO, INCHEON, KR;PARK, JAE-HONG, KYUNGKI, KR
分类号 H01L29/73;H01L21/331;H01L29/06;H01L29/40;H01L29/732;(IPC1-7):H01L29/732 主分类号 H01L29/73
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