发明名称 Zusammengestellte Schaltungsplatte und Herstellungsverfahren dafür
摘要 The composite circuit board comprises a substrate (13) made of an insulating material, a thick circuit conductor (11), embedded in this substrate (13), which includes a parts-mounting section (11a) and has a predetermined circuit pattern, a thin circuit conductor (12), provided on the surface of said substrate (13), which includes a land (12a) corresponding to the parts-mounting section (11a) of said thick circuit conductor (11) and has a predetermined circuit pattern, and a conductor means (14, 14a) for electrically connecting said land and said parts-mounting section. In this circuit board, the land (12a) and the part-mounting section (11a) are connected by a conducting member provided in this through hole (14). <IMAGE>
申请公布号 DE69032919(D1) 申请公布日期 1999.03.11
申请号 DE1990632919 申请日期 1990.11.27
申请人 THE FURUKAWA ELECTRIC CO., LTD., TOKIO/TOKYO, JP 发明人 YAMAMOTO, MASAAKI, ASAHI-KU, YOKOHAMA-SHI, JP;YATABE, HIROSHI, ISOGO-KU, YOKOHAMA-SHI, JP;KOBAYASHI, KENZO, SHINJUKU-KU, TOKYO, JP;MOCHIZUKI, HAJIME, TOKOROZAWA-SHI, SAITAMA-KEN, JP
分类号 H01L21/48;H01L23/538;H05K1/00;H05K1/02;H05K3/20;H05K3/42;H05K3/46;(IPC1-7):H01L23/538 主分类号 H01L21/48
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