Vorrichtung und Verfahren zum Beheizen eines flüssigen oder zähflüssigen Poliermittels sowie Vorrichtung zum Polieren von Wafern

摘要

The invention relates to a device for heating a liquid or semiliquid medium, especially a polishing agent for chemical mechanical polishing. Said device has a pipe and a heating device for the medium to be heated. The heating device is configured as a heat exchanger (30) which is positioned in said pipe (20). The invention also relates to a device for polishing wafers with the inventive heating device, the heat exchanger (30) of the heating device (10) being preferably arranged over a short section of the pipe (20b) in the vicinity of a distributor (25). Finally, the invention also relates to a method for heating a liquid or semiliquid medium.