| 摘要 |
A tripartite lead frame-based Vertical Interconnect Package (VIP) provides integrated feedthrough and integrated shielding in a non-ceramic package, particularly for high frequency applications. One frame 15 functions as the substrate for coupling an IC device 34, and a second lead frame 24 and third lead frame (40, fig 4) form shielding and feedthroughs, with the third lead frame also providing a lid whereby an airtight chamber around the IC device is formed. The VIP provides a ground button (the shortest path to the die) divided into n sections providing additional RF and separate ground paths; lead frame connections are used for DC. The leads of the first lead frame 15 may be encapsulated in plastics 29. In a modification the package includes five lead frames housing two IC devices. The lead frames are conductive, e.g. of copper. The VIP provides easy interfaces to the printed circuit board in surface mount technology manufacturing and is compatible with die mount technologies such as flip-chip. |
