Integrated circuit packaging method, packaging apparatus, and package

摘要

An integrated circuit package is formed by placing conductive traces on a substrate and forming holes through the substrate with at least one of the holes at least partially bordered by a conductive trace. The substrate is placed over a die having die pads such that at least one hole in the substrate is aligned with a die pad. A conductive piece is inserted through a hole in the substrate to make a mechanical and electrical connection between the die pad and the conductive trace proximate the hole in the substrate.