发明名称 Method and apparatus for dicing a substrate
摘要 <p>A laser device dices a substrate by generating a continuous wave-oscillation laser beam 3 that is converged by a lens 4 and focused at a predetermined focus O between the surface of the substrate 1 and a tip of a nozzle of a guide 5. Then, the focus is expanded to result in a laser beam 3a having a beam spot diameter of S at the surface of the substrate 1. A flow of assist gas G0, G1, G2 having a predetermined constant pressure is supplied from a gas intake 6 surrounding the laser beam 3. As the laser beam 3a is defocused, the beam spot diameter S is expanded and its energy distribution is moderated. The gas is blown onto the substrate 1 at constant pressure in order to suppress generation of strains due to thermal deformation.</p>
申请公布号 GB2303095(B) 申请公布日期 1999.03.10
申请号 GB19960014061 申请日期 1996.07.04
申请人 * HITACHI CABLE, LTD. 发明人 KATSUYUKI * IMOTO;SHINOBU * SATO
分类号 B23K26/12;B23K26/14;C03B33/09;(IPC1-7):B23K26/00 主分类号 B23K26/12
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