发明名称 |
Method and apparatus for plating a substrate |
摘要 |
<p>A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method comprises immersing the substrate in a liquid held in a processing chamber; evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities; and subjecting the liquid to boiling in at least those regions adjacent to the substrate. <IMAGE></p> |
申请公布号 |
EP0901153(A2) |
申请公布日期 |
1999.03.10 |
申请号 |
EP19980116569 |
申请日期 |
1998.09.02 |
申请人 |
EBARA CORPORATION |
发明人 |
KURIYAMA, FUMIO;HONGO, AKIHISA;INOUE, HIROAKI;TOKUOKA, TSUYOSHI |
分类号 |
H01L21/00;(IPC1-7):H01L21/00;C23C18/18 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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