发明名称 Method and apparatus for plating a substrate
摘要 <p>A high quality metallic deposit can be produced inside the micro-cavities formed on a surface of a substrate by the present invention. The method comprises immersing the substrate in a liquid held in a processing chamber; evacuating the processing chamber so as to remove residual bubbles from the micro-cavities and to degas the liquid within the micro-cavities; and subjecting the liquid to boiling in at least those regions adjacent to the substrate. &lt;IMAGE&gt;</p>
申请公布号 EP0901153(A2) 申请公布日期 1999.03.10
申请号 EP19980116569 申请日期 1998.09.02
申请人 EBARA CORPORATION 发明人 KURIYAMA, FUMIO;HONGO, AKIHISA;INOUE, HIROAKI;TOKUOKA, TSUYOSHI
分类号 H01L21/00;(IPC1-7):H01L21/00;C23C18/18 主分类号 H01L21/00
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