| 摘要 |
PROBLEM TO BE SOLVED: To provide the manufacture of a wiring board for forming the wiring pattern of excellent shape and dimension accuracy on a resin insulation layer regardless of a coarsened state on the surface of the resin insulation layer. SOLUTION: This method is provided with a process for coarsening the surface of the resin insulation layer 6 formed on the upper surface of a core substrate 1 and turning it to a recessed and projected surface 6a, the process for forming a conductor layer 8 by electroless plating on the resin insulation layer 6, the process for applying liquid first resist 9 onto the conductor layer 8, hardening it and sticking the second resist 10 of a dry film on it, the process for performing exposure and development to a resist layer 11 composed of the two layers and forming an opening pattern 12 between plating resist 11a and that, the process for executing electrolytic copper plating inside the opening pattern 12 and forming the wiring pattern 15 and the process for peeling off the plating resist 11a and removing the conductor layer 8 positioned other than the lower part of an electrolytic plating layer 14. |
