| 摘要 |
PROBLEM TO BE SOLVED: To improve productivity of a product (mold package) by easily removing unnecessary resin and resin flash cured in a resin passage such as a gate, etc., when a sheet member to which an electronic component is fitted is resin- sealed/molded. SOLUTION: A thin covering member 12 is stretched and moved between a fixing die 1 and a set part 5 of a movable die 2 onto which a sheet member 4 is supplied/set, using a moving mechanism 13. Furthermore, when both dies 1 and 2 are mold-clamped, the thin covering member 12 covers the sheet member 4 and is fixed to it except a resin sealing range for resin sealing/molding, and after resin sealing/ molding, the thin covering member 12 is removed from the sheet member 4 in the set part 5. |
