发明名称 Modular design for an IC testing burn-in oven
摘要 A compact and modularly designed apparatus for testing and burning-in semiconductor devices comprises first and second power supplies and the use of direct current (DC) to DC converters. The first power supply provides high voltage low amperage power to drive the devices under test (DUTs), and the second power supply supplies 15 volts and 5 volts to drive the circuitry on the testing equipment. The high voltage and low amperage is supplied to slot boards, and the DC to DC converters alter the voltage and current to digital levels. Supplying high voltage and low amperage power through the system to a location electrically near the DUTs, then converting it with DC to DC converters to power the DUTs, allows for much smaller connectors and for a modularly designed burn-in oven.
申请公布号 US5880592(A) 申请公布日期 1999.03.09
申请号 US19930091953 申请日期 1993.07.15
申请人 MICRON TECHNOLOGY, INC. 发明人 SHARPES, MICHAEL J.;TOTORICA, ROBERT L.
分类号 G01R31/28;(IPC1-7):G01R31/00 主分类号 G01R31/28
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