| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an electronic component housing package, which makes completely the hermetic sealing of a container and can actuate an electronic component, which is housed in the interior of the container, normally and stably extending over a long period of time. SOLUTION: In an electronic component housing package, which consists of a ceramic base body 1 having a frame body 2 on the outer peripheral part of the upper surface thereof, a frame-shaped metallized metal layer 7 adhered on the upper surface of the frame part 2, a metal frame body 8 soldered to the metallized metal layer 7 and a metallic cover body 3, which is welded to the metal frame body 8 and is housed hermetically with an electronic component 4 in the interior thereof, and the coefficient of thermal expansion at 200 to 800 deg.C of the frame body 8 is set at 7.5×10<-6> / deg.C or lower.</p> |
