发明名称 BONDING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent a deformation stress biased in the direction to a beam lead by a method wherein an arrangement direction of the beam lead is detected, and an arm is pivoted so that a rolling pattern directs to a direction adapted to the arrangement direction of the beam lead. SOLUTION: A controller 15 recognizing an arrangement direction of a beam lead 3 pivots an arm support body 8 so that a line of patterns formed in a bonding tool 10 corresponds to the arrangement direction of the beam lead 3 based on the arrangement direction of the beam lead 3 extending until a first terminal 2. Actuators 4, 6 of tables 5, 7 are respectively controlled so that a tip of the bonding tool 10 is positioned upwardly of the terminal 2 based on the arrangement direction and the position of the first terminal 2. Thereby, a deformation stress to a partial direction does not act on a face of the beam lead 3, and accordingly it is possible to attain bonding results with high reliability in which a short-circuit does not occur or a joint force is not reduced.</p>
申请公布号 JPH1167844(A) 申请公布日期 1999.03.09
申请号 JP19970228394 申请日期 1997.08.25
申请人 MITSUI HIGH TEC INC 发明人 MATSUBARA TOSHIYA
分类号 H01L21/60;H01L21/607;(IPC1-7):H01L21/60 主分类号 H01L21/60
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