| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a processing apparatus which can realize simultaneous processing of the front and back surfaces of a substrate and can especially homogeneously process the back surface of the board. SOLUTION: A processing apparatus 13 includes a spin chuck 20 for rotatably holding a wafer W, a nozzle 24 for subjecting the wafer W held in the chuck 20 to surface treatment, a front-surface scrub cleaning device 25, a nozzle 30 for processing the back surface of the wafer W held in the chuck 20, and a back-surface scrub cleaning device 31. In the apparatus, a rotary shaft 27 of the chuck 20 is made hollow, and the back-surface processing nozzle 30 and scrub cleaning device 31 are disposed within the hollow space.</p> |
