| 摘要 |
PROBLEM TO BE SOLVED: To avoid moisture absorption through heat radiating vias and improve heat radiation, by filling these vias with a metal having a high thermal conductivity and low moisture absorption. SOLUTION: A package 200 comprises a printed circuit board 110 having a chip mounting region 160 and a circuit pattern 15, a semiconductor chip mounted on the mounting region 160, bonding wires 140 for electrically connecting the semiconductor chip to a circuit pattern 115, a package body 150 formed with the sealed semiconductor chip and the bonding wires 140, and solder balls 130. Heat radiating vias 162a are formed in a lower part of the chip-mounting region 160 to radiate out the heat generated during operating of the chip and filled with a low-m.p. metal 172 to avoid penetrating the water content in the package body, and to improve the heat radiation. |
