| 摘要 |
PROBLEM TO BE SOLVED: To enable external terminals located at the center of a package and hard to process in a printed wiring board to be easily led outside, and a part of the printed wiring board where wirings are high in density to be locally relaxed in wiring density. SOLUTION: A wiring auxiliary package 11 which contains no semiconductor integrated circuit inside and is equipped with only a circuit wiring 12 and outer terminals is provided to be arranged, corresponding relatively to an existing IC 10 through the intermediary of a printed wiring board, a wiring bypass package equipped with only the circuit wiring 12 and the outer terminals is provided to be arranged between existing semiconductor packages. These packages can be formed by cutting them out of a waste board of a printed wiring board main body. |
