| 摘要 |
PROBLEM TO BE SOLVED: To realize reduction in size and cost of an entire device and also increase operation reliability. SOLUTION: On a circuit chip 10 having a sensor output processing circuit, bump electrodes 11 and rectangular frame-shaped sealing bumps 12 are located so as to surround the bump electrodes 11 formed from Sn-Pb solder. On a sensor chip 1 having a sensing section 5 including a beam structure, electrode pads 8 to be thermocompression-bonded to the bump electrodes 11 and pads 9 for junction to be thermocompression-bonded to the sealing bumps 12 are formed. With the sensor chip 1 being face-down bonded onto the circuit chip 10, there is an airtight space 13 formed by sealing the sensing section 5 by sealing the bumps 12. |
