| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical module provided with superior optical coupling property and package moldability. SOLUTION: For this optical module 31, a silicon substrate 17, on which highly accurately optically coupled laser diode 19 and optical fiber 6 are fixed and mounted and a lead frame 22 for holding the silicon substrate 17, are integrally packaged by a sealing body 14, composed of the hardened object of thermosetting liquid resin for injection molding and provided with the fiber projection part 14a of a fillet form formed by surrounding the periphery of the substrate root part of the optical fiber 6, whose one part is extended from the silicon substrate 17. |
