| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a printed wiring board in which adhesion is enhanced between an insulation resin layer and a metal foil having extremely thin width and interval by providing a step for making thin the metal foil uniformly, a step for plating the metal foil, and a step for forming a circuit pattern by subtractive method. SOLUTION: An insulation resin layer and a metal foil are laminated to produce a board and then the metal foil is made thin uniformly over the entire surface thereof to produce thin layer metal foils 2, 4. Subsequently, holes 5, 6 are made at desired positions by means of a laser 9 and the inner wall of the hole is subjected to plating along with the thin layer metal foils 2,4, thus obtaining a contact hole (through hole, via hole 7) and thick thin layer metal foils 2', 4'. The thick thin layer metal foil is subjected to subtractive etching to form a circuit pattern 8. A surface protective coating is formed, as required. According to the method, adhesion is enhanced through combination of a plating metal and a metal foil excellent in adhesion to the insulation resin and fine patterning can be realized. |
