| 摘要 |
PROBLEM TO BE SOLVED: To obtain a semiconductor manufacturing apparatus, which effectively uses the installation space of a semiconductor manufacturing facility and which reduces the cost of investment in facility and equipment. SOLUTION: A space 28 which is stretched to spaces other than a clean room, in which an enclosure 25 is installed, is installed at the inside of the enclosure 25. A cassette holder 34 is installed inside the space 28. A charging port 35 is installed on the boundary between the spaces other than the clean room and the space 28. At this time, a wafer cassette is carried in and out via the space 28 between the spaces other than the clean room and the inside of the enclosure 28 inside the clean room. |
