| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for jointing a semiconductor which enables attainment of recognition at the time of putting a carrier and a semiconductor chip on each other and the execution of accurate assembling and jointing, in the case of surface mounting. SOLUTION: This equipment is constituted of a carrier transfer mechanism 5 for transferring a carrier tape 100, a position alignment stage 13 provided along the carrier tape 100, a jointing mechanism 16 for providing a semiconductor element part fixedly on the carrier tape 100 by the position alignment stage 13 and a main control part 15 for controlling the operation of each part. In this case, a positional slippage detection mechanism 14 which detects a positional slippage of the semiconductor element part from the carrier tape 100 is provided between the jointing mechanism 16 and the position alignment stage 13. The main control part 15 operates on the basis of the information on the positional slippages sent from the positional slippage detection mechanism 14 and shifts the position alignment stage 13 in the direction, wherein the slippage of the semiconductor element part from the carrier tape 10 is reduced. |
