| 摘要 |
PROBLEM TO BE SOLVED: To exhibit characteristics of each element to the utmost, by mounting a plurality of kinds of optical elements on the same substrate, and covering the elements of different kind with sealing resin different in material quality, function, etc. SOLUTION: A light emitting element 2, a light receiving element 3 and an IC 4 for driving and controlling the elements are mounted on a substrate 1 by die bonding, and electrically connected through bonding wires 5. Transparent sealing resin 7 covering the light emitting element 2 is composed of colorless transparent epoxy resin which does not contain visible light shielding agent. Sealing resin 8 which contains the visible light shielding agent and covers the light receiving element 3 and the IC 4 is composed of epoxy resin or the like. As the sealing resin 8, the same material as the conventional one can be used. The transparent sealing resin 7 and the sealing resin 8 containing the visible light shielding agent may be separately molded. In order to realize miniaturization and exhibit sealing effect, it is more preferable that the gap between the sealing resin parts is eliminated and the boundary is contact-bonded. |
