| 摘要 |
PROBLEM TO BE SOLVED: To provide a wire which does not cause a migration and surface discoloration and has excellent soldering characteristics by interposing a plating layer by palladium-nickel alloy as an intermediate layer between an inner layer and an outer layer of a lead wire where a nickel plating layer is formed on a conductor as the inner layer and a palladium plating layer is formed as the outer layer. SOLUTION: An inner layer 2 by a nickel plating layer formed by an electrolytic method is arranged on a copper conductor 1, and a palladium-nickel alloy plating layer similarly formed by the electrolytic method is interposed on its outside as an intermediate layer 4, and an outer layer 3 by a palladium plating layer similarly formed by the electrolytic method is arranged on the outermost side. In the composition of the palladium-nickel alloy plating layer formed as the intermediate layer 4 by the electrolytic method, the palladium content in alloy is desirable to be 20 to 80 wt.%, and its thickness is desirable to be not less than 0.005 μm. |
