MULTI-LAYER CIRCUIT BOARD AND MANUFACTURE THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a multi-layer circuit board capable of the decoupling of a power supply line or the like without providing a chip capacitor or the like in the multi-layer circuit board of resin obtained by a build-up method. SOLUTION: For this board, plural one-sided metallic foil films for which metallic foil is adhered to one surface of a resin film composed of thermosetting resin are laminated and formed on both surfaces of a core substrate 12 and respective conductor patterns 18a-e and 20a-e formed from the metallic foil are held among resin layers 14a-d and 16a-d composed of the resin film and electrically connected by via holes 24 passed through the resin layers 14a-d and 16a-d. In this case, the resin layers 14c and 16c and the core substrate 12 for forming the multi-layer circuit board 10 held between the conductor pattern for the power supply line and the conductor pattern for a ground line are formed by the resin to which dielectric material powder whose dielectric constant at 1 MHz is equal to or more than 100 is mixed.