| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase reliability in electrical connection between connection terminals formed on the surface of a semiconductor device and the wiring of a printed wiring board. SOLUTION: On a printed wiring board 1, on which the wiring having wiring connections 2 is printed, a semiconductor device which has on the surface of a semiconductor device 3, Au stud bumps 4 so formed as to correspond to the wiring connections 2 is mounted by flip-chip attachment. Then, an anisotropic conductive resin film 5 is formed as a material for jointing the printed wiring board 1 and the semiconductor substrate 3. As for the material of the anisotropic conductive resin film 5, a material is used such that it has a coefficient of thermal expansion the same as or lower than that of Au, from which the Au stud bumps 4 are formed.</p> |
