MOUNTING METHOD FOR CHIP COMPONENT AND CHIP COMPONENT USED FOR THE METHOD,申请号JP19970228451-传众专利搜索

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发明名称	MOUNTING METHOD FOR CHIP COMPONENT AND CHIP COMPONENT USED FOR THE METHOD
摘要
申请公布号	JPH1168301(A)	申请公布日期	1999.03.09
申请号	JP19970228451	申请日期	1997.08.25
申请人	NEC CORP	发明人	SUEYASU TOSHIJI
分类号	H01G4/228;H05K1/18;H05K3/34;(IPC1-7):H05K3/34	主分类号	H01G4/228
代理机构		代理人
主权项
地址

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