发明名称 METHOD OF MOUNTING ELECTRONIC COMPONENT AND ITS DEVICE
摘要 PROBLEM TO BE SOLVED: To decrease a time required for mounting a component. SOLUTION: A control section 7, when a component 14 is sucked to a suction nozzle 5 and mounted on a print substrate 15 through an suction controller 8, X-axis controller 9, and Y-axis controller 10, rotates a component 14 sucked to the suction nozzle 5 in a predetermined direction through a θ axis controller 12, and detects a projected width of the component 14, and obtain a correction value to accurately mount the component 14 on the predetermined point of the substrate 15. The control section 7 continuously rotates the suction nozzle in the same predetermined direction and add the correction value during the rotation after the detection of the projected width so that the component has a predetermined mount angle to the print substrate 15.
申请公布号 JPH1168397(A) 申请公布日期 1999.03.09
申请号 JP19970228939 申请日期 1997.08.12
申请人 YAMAGATA CASIO CO LTD 发明人 MATSUDA YASUNAKA
分类号 B23P21/00;H05K13/04;H05K13/08 主分类号 B23P21/00
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