发明名称 |
Low-temperature fired ceramic circuit substrate and thick-film paste for use in fabrication thereof |
摘要 |
A low-temperature fired ceramic circuit substrate fired at a temperature ranging between 800 DEG and 1,000 DEG C. includes a plurality of insulating layers each formed of a low-temperature fired ceramic, an Ag conductor layer formed internally of the substrate, an Au conductor layer formed on a surface of the substrate, and an Ag-Pd layer formed between the Ag and the Au conductor layers, the Ag-Pd layer being composed of 100 parts metal composition consisting of 70 to 95 parts Ag and 5 to 30 part Pd by weight, and 2 to 10 parts lead borosilicate glass by weight. As the result of the above composition of the ceramic circuit substrate, its fabrication process can be simplified, and a defect rate in a connection between the Ag and Au layers after repeated firing is rendered approximately zero, which ensures high reliability for the connection.
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申请公布号 |
US5879788(A) |
申请公布日期 |
1999.03.09 |
申请号 |
US19970816032 |
申请日期 |
1997.03.11 |
申请人 |
SUMITOMO METAL (SMI) ELECTRONICS DEVICES, INC. |
发明人 |
FUKUTA, JUNZO;FUKAYA, MASASHI;ARAKI, HIDEAKI |
分类号 |
H05K1/09;H01B1/00;H01B1/22;H01L23/498;H05K1/03;H05K1/11;H05K3/24;H05K3/40;H05K3/46;(IPC1-7):B32B7/00 |
主分类号 |
H05K1/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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