| 摘要 |
PROBLEM TO BE SOLVED: To enable a support plate to be electrically isolated from an outer lead member surely and easily. SOLUTION: A semiconductor chip 17 is fixed to a support plate 12 of a lead frame. A tip part 13a of an outer lead member 13 is arranged on an insulating sheet 16, and an inner lead fine wire 19 is connected to the tip part 13a of the outer lead member 13 through a wire bonding method. An insulating sealing body 20 is provided through a transfer molding method, so as to cover the upper side of the support plate 12. |
