| 摘要 |
PROBLEM TO BE SOLVED: To obtain epoxy resin composition of single liquid material which enhances the filling characteristic of a resin into a part between a flip-chip chip and a substrate and whose reliability is increased, by a method wherein an epoxy resin, an acid anhydride-based hardener and a globular silical powder in a specific mean particle size and a specific maximum particle size or lower are used as essential components, and a fire retardant, a coloring agent and the like are added as required. SOLUTION: As essential components for epoxy resin composition of a single liquid material, an epoxy resin which contains two or more epoxy resin groups in one molecule and which can be hardened, e.g. a bisphenol A-type epoxy resin or the like, is enumerated as an epoxy resin, and a phthalic anhydride-type derivative such as methylhexahydrophthalic acid or the like, methyl nadic anhydride and the like are enumerated as acid anhydride hardeners. As the silica powder, a globular silical powder is used widely, its mean particle size is at 1.0 to 4.0μm, and its maximum particle size is at 20μm or lower. As required, a coloring agent, a fire retardant and the like are mixed properly, a liquid sealing material is prepared in such a way that the respective components are mixed sufficiently, that a kneading treatment is executed additionally, and that air bubbles are then removed under a reduced pressure.
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