| 发明名称 |
Method of bumping substrates by contained paste deposition |
| 摘要 |
A solder bump is stenciled onto a substrate, providing bumped substrate at pitches below 400 microns. The solder is applied through stencil/mask and paste method; the mask, however, remains attached to the substrate during reflow. Pitches of greater than 400 microns may also be obtained through the invention. The invention further provides for generation of uniform, controllable volume metal balls.
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| 申请公布号 |
US5880017(A) |
申请公布日期 |
1999.03.09 |
| 申请号 |
US19970920221 |
申请日期 |
1997.08.25 |
| 申请人 |
HEWLETT-PACKARD CO. |
发明人 |
SCHWIEBERT, MATTHEW K.;CAMPBELL, DONALD T.;HEYDINGER, MATTHEW;KRAFT, ROBERT E.;VANDER PLAS, HUBERT A. |
| 分类号 |
H01L21/48;H01L21/56;H01L21/60;H01L23/485;H01L23/498;H05K3/12;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/48 |
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