| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board wherein a high current can be instantaneously fed from a capacitor to an integrated circuit chip, and a method of manufacturing the multilayer printed wiring board. SOLUTION: A printed wiring board is formed by laminating copper-clad laminated boards 120 and 122 on the upper and lower surfaces of a substrate 20, formed with an internal layer copper pattern 28, and an integrated circuit chip 100 is housed in an open part 10A formed in a multilayered printed wiring board 10. A chip capacitor C consisting of ceramics is mounted on the pattern 28 formed on the substrate 20. Thereby, as a wiring length between the capacitor C and the chip 100 is shortened and the inductance component of a wiring is reduced, a high current can be fed momentarily from the capacitor C to an integrated circuit chip 100.</p> |
