发明名称 CONDUCTIVE PASTE
摘要 <p>PROBLEM TO BE SOLVED: To provide a conductive paste which can attain easy printing and little running. SOLUTION: This conductive paste involves conductive powder and binder as essential components, whereas 90-98 wt.% of the binder is thermosetting resin and its remainder is thermoplastic acrylic resin. The thermosetting resin consists of macromolecular weight thermosetting resin of weight average molecular weight 3,500-10,000 and low molecular weight thermosetting resin of weight average molecular weight 350-3,500, and the weight average molecular weight of macromolecular weight thermosetting resin is twice or more times the weight average molecular weight of low molecular weight thermosetting resin.</p>
申请公布号 JPH1166954(A) 申请公布日期 1999.03.09
申请号 JP19970216344 申请日期 1997.08.11
申请人 HITACHI CHEM CO LTD 发明人 YAMANA SHOZO;TASHIRO AKITSUGU;KUWAJIMA HIDEJI
分类号 H05K1/09;C09D5/24;C09D11/033;C09D11/10;C09D11/103;C09D11/106;C09D11/52;C09D133/00;H01B1/22;(IPC1-7):H01B1/22 主分类号 H05K1/09
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