| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device at a manufacturing cost by directly mounting a semiconductor pellet through a socket and reducing the number of manufacturing processes. SOLUTION: On one side of a bare-chip state semiconductor pellet 1, a contact part 5 of specified size pattern is formed, and a socket 2, comprising a connection terminal inside while an external connection terminal outside, where terminals are electrically connected is mounted with the semiconductor pellet 1. Here, a metal film of the semiconductor pellet 1 is connected mechanically to the connection terminal of the socket 2. Inserting and taping-out of the semiconductor pellet from the socket is made easy. In addition, a plurality of semiconductor pellets 1 are mounted on the socket 2 in parallel.</p> |
