| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component, which does not generate poor conduction between bumps and electrodes of a substrate. SOLUTION: When mounting an electronic component 7 on a substrate 1 using a bond 4, electrodes 2 of the substrate 1 are precoated by a metal softer than metal bumps 8 of the electronic component to form precoated sections 3 on top of the electrodes 2. Then, a bond 4 is applied between the electrodes 2 of the substrate 1 and then the electronic component 7 is lowered to ground the bumps 8 on the precoated sections 3 and then pressed against the substrate 1 by a mounting head 6 to bury the bumps 8 in the precoated sections 3. The quantity of the bond 4 to be applied is so set that the bond 4 reaches the bumps 8 and the precoated sections 3, after the bumps 8 have been buried in the precoated sections 3. As a result, there is no possibility that the bond 4 will enter a space between the bumps 8 and the precoated sections 3, and therefore poor conduction will not be generated between the bumps 8 and the electrodes 2, due to the biting of a filler of the bumps 8 and that of the electrodes 2. |
