| 摘要 |
PROBLEM TO BE SOLVED: To make leveling height of protruding electrodes uniform with high precision by reducing the variance in leveling height of the protruding electrodes of a semiconductor element, when the height of a plurality of protruding electrodes formed on the semiconductor element is made uniform by sandwiching the semiconductor element between two plates and adding a load. SOLUTION: When the height of a plurality of protruding electrodes 1 formed on a semiconductor element 2 is made uniform by sandwiching a semiconductor element 2 between two plates 3 and 4 and adding a load, a material 5 that distorts elastically is inserted inbetween a surface 2a of the semiconductor element 2, on which the protruding electrode 1 is not formed and a leveling plate (on the lower side) 4, and under this condition, the tip of the protruding electrode 1 is squashed by adding the load, so that the height of the plurality of protruding electrodes 1 is leveled uniformly. |
