发明名称
摘要 PURPOSE:To obtain inexpensively and easily a hollow molding product on which a solid pattern is formed, by a method wherein after a thermoplastic resin film, to which the solid pattern is formed beforehand, is fitted to a mold cavity, blow molding is performed by making use of thermoplastic resin which is moldable at a specific resin temperature. CONSTITUTION:A thermoplastic resin film on which a solid pattern is formed is fitted to the inside of a mold cavity. It is necessary that the film possesses the molten point of a molding temperature of resin to be blow molded-at least -20 deg.C and crystallization is not advanced greatly at the time of molding. The melting point of a polybutylene terephthalate(PBT) resin film is about 225 deg.C and when such thermoplastic resin as to be blow molded at a temperature of 225+20 deg.C or blow, for example, polystyrene resin is used, a molding having the favorable solid pattern can be obtained. With this construction, in the case where polycarbonate resin whose molding temperature is higher than this is used, this becomes usable by metallizing the PBT resin film on which, for example, the solid pattern is formed. Decision as to whether an ordinary film is used or a metallized film is used depends whether or not a molding temperature of resin is lower than the melting point +20 deg.C of the resin constituting the film.
申请公布号 JP2866423(B2) 申请公布日期 1999.03.08
申请号 JP19900020207 申请日期 1990.01.29
申请人 HORIPURASUCHITSUKUSU KK 发明人 ITO HARUYASU;NEZU SHIGERU
分类号 C23C14/04;B29C49/02;B29C49/04;B29C49/24;B29K67/00;B29L9/00;B29L22/00;(IPC1-7):B29C49/02 主分类号 C23C14/04
代理机构 代理人
主权项
地址