| 摘要 |
PURPOSE:To enable a PGA type package to be mounted with improved accuracy on both sides of a printed-circuit board easily by mounting a package to be mounted at least on one surface through a mechanical connection means. CONSTITUTION:A pin for holding a package 21 is planted, for example, at the outside of outermost periphery of a signal pin 12 as a mechanical connecting means and the pin for holding package 21 and the side of surface 1A of a printed-circuit board 1 are adhered using an adhesive 22. Then, this printed circuit board 1 is reversed, the side of rear surface 1B of the printed-circuit board 1 is directed upward, and then a package is placed on it. Then, a solder cream 23 is applied to a foot print of both sides of the printed circuit board, it is inserted into a heating furnace while the signal pin 12 is being bonded, and a PGA package is mounted to both surfaces of the printed circuit board. |
