DEVICE FOR SEPARATING SOLDER IN WASTE PRINTED CIRCUIT

摘要

PROBLEM TO BE SOLVED: To obtain a device which separates solder from a waste printed circuit at high efficiency and can treat a large quantity of the printed circuits by providing a driving device for vibrating or rotating a vessel for incorporating the printed circuit into granular heat medium. SOLUTION: The vessel 4 for incorporating the printed circuits 3 unnecessitated is charged into the granular heat medium 2 fluidized by heating to the temp. having the m.p. or higher of the solder. The granular heating medium 2 is heated with a heater 8 for heating the heat medium and a heater 12 for heating the air and fluidized with a blower 13. The printed circuit 3 has excellent heat retaining property and rapidly heated with the granular heat medium 2 and the solder is made to melting or semi-melting condition. Thereat, at the time of vibrating the vessel 4 for incorporating the printed circuit with a driving device 5a for printed circuit incorporated vessel, the solder is simply separated from the printed circuit 3. Thereafter, the incorporated vessel 4 is pulled up upward to recover the printed circuit 3. The separated solder is shifted downward and stored into a solder storing part 25.