发明名称 COMPOSITION FOR MOISTUREPROOF INSULATION TREATMENT AND ELECTRICAL/ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain the subject composition suitable for moistureproof insulation or the like, and useful for forming cured products of excellent heat resistance and flame retardancy by including a hydrogenated product of hydroxyl-contg. liquid polyisoprene, a polyisocyanate, hydrated alumina, microballoon filler and a phosphoric ester. SOLUTION: This composition is obtained by including (A) a hydrogenated product of a hydroxyl-contg. liquid polyisoprene (pref. bearing hydroxyl group(s) in the molecule or molecular end(s), 0.6-1.5 meq/g in hydroxyl group content and 500-10,000 in number-average molecular weight), (B) a polyisocyanate (in such an amount as to be 0.7-1.5 equivalents in terms of the isocyanate group based on the hydroxyl group in the component A), (C) hydrated alumina (pref. granular one 0.1-100μm in particle size accounting for 15-85 wt.% of the whole composition], (D) a microballoon filler (pref. granular glass balloons 1-600μm in size accounting for 1-20 wt.% of the whole composition), and (E) a phosphoric ester (e.g. tricresyl phosphate accounting for 1-20 wt.% of the whole composition).
申请公布号 JPH1160938(A) 申请公布日期 1999.03.05
申请号 JP19970214812 申请日期 1997.08.08
申请人 HITACHI CHEM CO LTD 发明人 OBARA MASAKATSU;SHIGA SATOSHI
分类号 C08K3/22;C08G18/62;C08K5/521;C08K7/24;C08L75/04;C09D5/25;C09D175/04;H01L23/29;H01L23/31;(IPC1-7):C08L75/04 主分类号 C08K3/22
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