| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical semiconductor element-housing package capable of always exactly disposing an optical fiber and an optical semiconductor element opposite to each other, enhancing the efficiency of the transfer and receipt of light between the optical fiber and the optical semiconductor element and normally and stably operating the internally housed optical semiconductor element for a long period. SOLUTION: This package has an optical semiconductor element loading part 1a in the central part of its front surface and consists of a resin base body 1 which is provided with a frame part 2 enclosing the loading part on its outer peripheral part, an optical fiber fixing member 6 which is mounted to penetrate the frame part 2. In such a case, the modulus of elasticity in bending of the base body having the frame part 2 is >=2000 kg/mm<2> and the average coefft. of thermal expansion at 0 to 30 deg.C is 0.7×10<-5> to 1.1×10<-5> / deg.C.
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