| 摘要 |
PROBLEM TO BE SOLVED: To surely provide an electroless plating adhesive having acquired predetermined properties for the preparation of printed circuit boards by inhibiting the curing of an adhesive unavoidably occurring during storage of the adhesive. SOLUTION: As a starting material composition for preparing an electroless plating adhesive, each of the compositions: (1) a resin composition comprising an uncured thermosetting resin which comes to be difficultly soluble in an acid or an oxidizing agent by the curing treatment, (2) a resin composition comprising heat resistant resin particles soluble in an acid or an oxidizing agent having been subjected to the curing treatment, a thermoplastic resin and an organic solvent and (3) a curing agent composition has previously been prepared in a mixable state and, retained in a detached state. |
