发明名称 PROCEDE DE RELAXATION DE FILM CONTRAINT PAR FUSION DE COUCHE INTERFACIALE
摘要 A process for forming a stack of metamorphic III-V, II-VI or IV semiconductor material layers, exhibiting several percent lattice mismatch between themselves or wrt. the substrate, is carried out by (a) pseudomorphic deposition of an interfacial material (I) on the substrate material (S), of melting temperature (TF<s>), at below the melting temperature (TF) of the material (I); (b) pseudomorphic deposition of a material (E) of melting temperature (TF<e>) on the interfacial material (I) at below temperature (TF); (c) annealing of the interfacial layer (I) to cause relaxation of the material layer (E) by generating localised dislocations in the interfacial layer (I); (d) cooling of the interfacial layer (I); and (e) epitaxial growth of material (E) or any other material with the same lattice parameter (ae). Also claimed is a material obtained by the above process and used in the production of optoelectronic and microelectronic devices, e.g. a vertical microcavity laser.
申请公布号 FR2756972(B1) 申请公布日期 1999.03.05
申请号 FR19960015141 申请日期 1996.12.10
申请人 FRANCE TELECOM 发明人 HARMAND JEAN CHRISTOPHE;KOHL ANDREAS
分类号 C30B25/18;H01L21/20;(IPC1-7):H01L21/20;H01L21/36;H01L33/00 主分类号 C30B25/18
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