| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a die-attach resin paste improved in resistances to staining and soldering cracks by compounding a specific urethane (meth)acrylate resin with a specific (meth)acrylic resin, an org. peroxide and an inorg. filler. SOLUTION: 100 pts.wt. urethane (meth)acrylate resin represented by formula I or II (wherein R1 is H or CH3 ; and m and n are each an integer) and obtd. by reacting polypropylene glycol with isophorone diisocyanate and then with hydroxyethyl (meth)acrylate is compounded with 50-200 pts.wt. (meth)acrylic resin represented by formula III (R2 is H or CH3 ; and k is 10 or lower), 0.1-50 pts.wt. org. peroxide, 50-1,200 pts.wt. inorg. filler and required amts. of additives such as an antifoaming agent, a coupling agent and a surfactant. Thus is obtd. a die-attach resin paste for semiconductors which hardly causes staining of a substrate due to outgassing during curing and which forms a void-free cured layer.</p> |
