| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject composition that shows reduced warpage after molding or on the soldering treatment of the area-mounting package with excellent reliability by allowing the composition to include a specific epoxy resin, a specific curing agent, a curing accelerator and a specific powder. SOLUTION: (A) A crystalline epoxy resin melting at 50-150 deg.C, selected from a biphenyl type epoxy resin, a hydroquinone type epoxy resin of formula II, a stilbene type epoxy resin of formula III, and a bisphenol F type epoxy resin, (B) a phenolic resin type curing agent containing >=20 wt.% of a phenolic resin of formula V (m, n are each 1-10), (C) a curing accelerator as triphenyl phosphine, and (D) molten silica powder are used to give the objective composition that has preferably <=0.15% shrinkage out molding and curing, the coefficient of linear expansionα1 of 8-16 ppm/ deg.C after curing, the glass transition point of >=140 deg.C and the melt viscosity of <=150 poise at 175 deg.C before molding.
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