| 摘要 |
PROBLEM TO BE SOLVED: To detect the center and the shape of a ball with good precision even if it is a ball of deformed shape or a ball extruding from a pad, or even if there is a noise component of any other article than a ball, such as a wire, a pad, and an IC pattern. SOLUTION: By illuminating a bonding wire 3 on a semiconductor element, shooting the illuminated bonding wire 3 with a shooting means, and processing an image signal obtained by the shooting means, at least one of the position and shape of a ball section in the bonding wire 3 is measured. At this time, the ball edge 7 of the bonding wire 3 is detected, and a correlation value of the ball edge to a circle with prescribed radius is obtained. Based on the correlation value, the temporary central position and shape of the ball are calculated. Based on them, extraction of the ball section, and measurement of its position and shape are conducted. |
