Anordnung, umfassend ein Trägersubstrat für Leistungsbauelemente und einen Kühlkörper sowie Verfahren zur Herstellung derselben

摘要

The invention relates to an assembly comprising a substrate and a cooling element. A first side of the substrate is fitted with at least one power component arranged on a first large-surface strip conductor and the second side located opposite to the power component is provided with a second large-surface strip conductor, which is connected to the first conductor strip by means of heat-conductive throughplatings. The second side of the substrate is placed on the cooling element in such a way that heat is conducted. The invention seeks to provide good heat coupling of the substrate on the cooling element, while avoiding unwanted electrical contact between potential-conducting conductor strips and the cooling element. To this end, the substrate is placed on the cooling element using spacing elements arranged on the second side to set apart the substrate from the cooling element at a defined distance. The gap formed by the space between the substrate and the cooling element is filled with a heat-conductive filling material.